Ultra® systems

Plasma enhanced chemical vapor deposition (PECVD) and Reactive ion etching (RIE) technology systems

CVD processes are carried out by activation of the working gases by capacitive charge plasma (CCP) or induction charge plasma (ICP).
The ULTRA series is designed for R&D laboratories and small batch production of optics, photovoltaics, optoelectronics, MEMS, power electronics and microelectronics.