Vacuum system for double-sided or one-sided sputtering with ion cleaning and disc substrate holder
ATIS-500 vacuum system is intended for deposition of coatings by method of magnetron sputtering of the target material with preliminary ion-beam cleaning. The system allows to deposit coatings as on one or both sides of the substrates in one vacuum process.
The coatings are deposited on substrates installed on a substrate holder of disk type.
Features:
- Possibility to install up to 8 technological devices (up to 4 devices into top side of the system and up to 4 pcs. into bottom side)
- System of substrates heating for up to 400 оС
Technical data:
| Ultimate residual pressure in the clean technological vacuum chamber | 4E-4 Pa |
| Substrate size (for standard substrate holder) | 60×48 mm |
| Maximum quantity of substrates per run (for the standard substrate holder) | 35 pcs. |
| Maximum coating thickness uniformity | ± 2,0 %
|
| Coatings control | – Resistance measurement of a “witness” resistance
– Quartz system for thickness control – Control by time |
Technological devices:
- DC-magnetrons (possibility to install up to 6 pcs.)
- Ion-beam cleaning source (possibility to install up to 2 pcs.)
- RF-magnetron (optionally)
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