Ultra-high vacuum (UHV) sputtering system for single-sided deposition of precious metals
Features:
- Magnetron sputtering
- Resistive evaporation
- Possibility to install up to 4 technological devices
- System of substrates heating up to 400 оС
- Disc-type substrate holder (horizontal)
- Ultra-high vacuum version
Technical data:
| Ultimate residual pressure in the clean technological vacuum chamber | 5E-5 Pa |
| Substrate size (for the standard substrate holder) | Ø 4 in. |
| Maximum quantity of substrates per run (for the standard substrate holder) | 12 pcs. |
| Maximum coating thickness uniformity | ± 5,0 %
|
| Coatings control | – System of measurement of a “witness” resistance
– Control by time |
Technological devices:
- DC magnetron
- Ion beam cleaning source
- Resistive evaporation system
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