Drum-type vacuum system for single side sputtering of Resistive alloys by magnetron sputtering method
Features:
- Possibility to install up to 5 technological devices
- System of substrates heating for up to 350 оС
Technical data:
| Ultimate residual pressure in the clean technological vacuum chamber | 4E-4 Pa |
| Substrate size (for the standard substrate holder) | 60×48 mm |
| Maximum quantity of substrates per run (for the standard substrate holder) | 57 pcs. |
| Maximum coating thickness uniformity | ± 5,0 %
|
| Coatings control | – Resistance measurement of a “witness” resistance
– Quartz system for thickness control – Control by time |
Technological devices:
- Ion-beam cleaning source
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