Cluster®

Vacuum system that combines E-beam evaporation and magnetron sputtering technologies in one vacuum cycle

 

 Features:

• Magnetron and electron beam deposition of thin films on two sides of the substrate in a single manufacturing process
• Fully automated optical monitoring system in the wavelength ranges from UV to mid-IR (E-beam module)
• Quartz control system (magnetron module and E-Beam module)
• Possibility to integrate the equipment into a clean room

 

The equipment includes three modules:

E-beam technological module – designed for coating by electron beam evaporation with simultaneous ion assist on one side of the substrate.

Magnetron process module – designed for coating by magnetron sputtering of the target with RF pre-cleaning on the second side of the substrate.

Loading module – provides manual installation of substrates on the substrate holder and automatic movement of the substrate holder into the process modules without venting the process chambers.

The coating is applied to the substrates fixed on the disc substrate holder. Full automation of the processes of ion cleaning and assisting, evaporation and sputtering, using of quartz thickness monitor and optical control allows to obtain coatings with required properties and guaranteed repeatability.

 

Technical data:

Substrate holder	Single disk Ø 275 m
Maximum number of Ø 30 mm substrates per batch	26 pcs.
Technological devices (used in one vacuum cycle)	Circular magnetron (RF, DC) – 3 pcs RF plasma cleaning source E-beam or resistive evaporator Ion cleaning and assisting source
Ultimate residual pressure	5E-4 Pa
Pumping system	Oil-free pumping based on turbomolecular or cryogenic pumps
Heating system	300 °С
Coatings control	Quartz system for thickness control single wave or broad band optical monitoring system

 

 

Technological devices:

• DC- magnetrons
• RF-magnetrons
• E-beam
• Resistive evaporator
• RF ion source
• Ion beam cleaning source