Universal sputtering systems for R&D and small batch production
A wide range of possible configurations of ELATO vacuum systems allows to be maximum flexible in configuring the system for the exact tasks.
Features*:
- Electron Beam Evaporation (E-beam) system
- Resistive evaporation system
- Magnetron sputtering system
- Ion beam cleaning system
- Substrate holder: single disc, dome
- Load lock chamber (option)
- Substrate heating system up to 400 °C
- High efficiency in sputtering of precious metals
*the configuration of technological devices is determined in accordance with the customer’s requirements
Technological devices:
- Electron-beam evaporation system
- Resistive evaporation system
- Ion-beam source for cleaning and assistance
- RF-magnetrons
- RF ion-beam assistance source
- DC-magnetrons
Technical data:
| Diameter of the technological vacuum chamber | 600 mm |
| Substrate holder | Single disc Ø 500 mm
Dome Ø 500 mm |
| Diameter of dome substrate holder | 300 mm |
| Maximum uniformity coating thickness* | ±2.5 % for dome substrate holder
±1.0 % for 10 x Ø 100 mm ±1.0 % for 4 x Ø 150 mm ±3.0 % for 3 x Ø 200 mm |
| Technological devices | E-beam, resistive evaporator, DC magnetrons, RF magnetrons |
| Surface preparation and assisting | Ion-beam cleaning source (IBS), End-Hall ion source for cleaning and assistance, RF ion assist source |
| Coating control | Quartz system for thickness control
Single wave or broadband optical monitoring system |
| Ultimate residual pressure in a clean process chamber | 1E-4 Pa |
| Waste disposal facilities | Oil-free pumping based on turbomolecular or cryogenic pumps |
| Load Lock chamber | Option |
*Coating uniformity may vary from one technological device to another
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