System of automatic broadband optical control of the sputtering process
Features:
- Fully automation of the sputtering process for complex multilayer coatings
- Optimization of the coating structure during the sputtering process
The main control mode is the measurement of optical transmittance on the substrate (witness) placed directly on the rotating substrate holder (direct measurement). The spectrometer measures the real spectrum of the coating over the entire operating range after each rotation of the substrate holder
Optimization algorithms monitor the current result during the sputtering process and, in case of deviations on previous layers, recalculate the structure and introduce corrections on the next layers to compensate for previous deviations.
Technical data:
| Spectral subrange | 380×1080 nm | 1080х1650 nm | 220х380 nm |
| Spectral resolution | 0,5 nm | 5,0 nm | 0,5 nm |
| Wavelength accuracy | ± 0,2 nm | ± 1,0 nm | ± 0,2 nm |
| Wavelength repeatability | ± 0,1 nm | ± 0,5 nm | ± 0,1 nm |
| Monitor type | Intermittent (direct): transmission
continious (indirect): transmission, reflection, backside reflection |
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| Detector | CMOS (Hamamatsu) | ||
| Light source | DC-stabilized Quartz Tungsten Halogen | Deuterium | |
| Software for thin film design | OptiLayer, IzoSpectra, FilmStar, MS Excel, Essential Macleod | ||
| Data exchange | OPC UA
Modbus TCP/IP Other by request |
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| Test glass changer | 8 position test glass changer integrated with 4 position cooled quartz crystal changer | ||
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