Vacuum system for single side or double side metal sputtering
Features:
- Electronic evaporation system with ring cathode
- Resistive evaporation system
- Magnetron sputtering system
- Ion beam cleaning system
- Double-sided or single-sided sputtering
- Drum-type substrate holder (horizontal)
Technological devices:
- Magnetrons
- Ion-beam cleaning source
- Resistive evaporation system
- Electron evaporator with a ring cathode
Technical data:
| Versus®-74 | Versus®-74М | |
| Ultimate residual pressure in the clean technological vacuum chamber | 8E-4 Pa | |
| Substrates size (for standard substrate holder) | 48×60×1,0 mm; 48×60×0,5 mm;
48×60×0,25 mm; 30×24×0,3 mm; 30×24×0,2 mm |
48×60×1,0 mm; 48×60×0,5 mm;
48×60×0,25 mm; 30×24×0,3 mm; 30×24×0,2 mm Ø 76 mm, Ø 100 mm |
| Maximum quantity of substrates per one run (for 48×60 mm substrates) | 57 pcs. | |
| Technological devices | Resistive evaporator,
Electronic evaporator with ring cathode |
Magnetrons (up to 4 pcs. on external flanges),
Ion beam cleaning source |
| Maximum coating thickness uniformity | ± 15,0 % | ± 5,0 % (if magnetrons are used)
± 15,0 % (if resistive evaporation system and electron evaporator with a ring cathode are used) |
| Pumping system | Oil-free pumping based on turbomolecular or cryogenic pumps | |
| Process control | – Resistance measurement of a “witness”
– Quartz system for thickness control |
|
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